Qualcomm ultrasonic fingerprint sensor can be found in the new iPhone, will get a larger recognition area

Americans will be better in terms of safety in the upcoming iPhones in 2020. According to a report by Mac Roomers, Qualcomm’s ultra-sonic fingerprint sensor will be used in the upcoming iPhone in 2020. Apple has joined hands with Taiwanese touchscreen manufacturer GIS to use this new technology in the upcoming new iPhones in 2020-21.

Qualcomm on Tuesday introduced its new 3D Sonic Max ultrasonic fingerprint at the 3rd Annual Snapdragon Technology Summit. It is 17 times bigger than before as well as faster. It has a much larger recognition area. Users can have two fingers scanned in it, which can prove to be beneficial in terms of security. However, Qualcomm also supplies its ultrasonic fingerprint sensor to South Korean tech company Samsung for use in Samsung Galaxy S10 and Galaxy Note 10. But Apple wants to use a more advanced version of the fingerprint sensor in the upcoming iPhone 2020-21.

Four iPhones can be launched in 2020

According to JP Morgan analyst Samik Chatterjee, Apple will launch a 5.4-inch iPhone, two 6.1-inch iPhones and a 6.7-inch iPhone that will be equipped with 5G connectivity. According to Chatterjee, the company will get two high-end models (6.1 inches and 6.7 inch) mm wave support. Also, this triple-lens camera and will be equipped with ‘world facing’ 3D sensing technology for better-augmented reality. Whereas two low-end models (6.1 inches and 5.4 inches) will get dual lenses, it will not get MMWave support and 3D sensing technology.

According to the report, Apple will use Qualcomm’s X55 modem in the upcoming iPhone in 2020, with support for MM Wave and the sub-6 GHz spectrum. All four iPhones will be equipped with OLEDs. It is expected that Apple can use Samsung’s display, which will be one of the thinnest displays ever.